TI tscircuit library

This repo contains hand-curated tscircuit TSX schematics for Texas Instruments devices, reusable TI reference subcircuits, and raw TI chip definitions.

The published package is @tsci/tscircuit.ti. It provides ready-to-use subcircuit components and low-level chip components that can be imported into a local tscircuit project, placed on a board, and connected to from the surrounding circuit.

Installation

bun add @tsci/tscircuit.ti

Basic Usage

Import the TI part you need from the package and place it inside a board.

import { PowerMonitor_INA237 } from "@tsci/tscircuit.ti"

export default () => (
  <board width="18mm" height="14mm">
    <PowerMonitor_INA237 name="INA237" />
  </board>
)

Complete Examples

The BluetoothSpeaker_CC2564C_TAS2505.circuit.tsx example composes the CC2564C Bluetooth controller, MSP430F5229 host, TAS2505 audio amplifier, BQ24074 battery charger, and TPS7A2018 1.8 V regulator into a connected Bluetooth speaker schematic.

The ObstacleDetectionSensor.circuit.tsx example composes the TIDEP-01024 AWR1843AoP radar SoC, 40 MHz clock, and QSPI flash into the radar front-end and processing subsystem.

The BloodPressureAndHeartRateMonitor_TIDA010266.circuit.tsx example reproduces TI's TIDA-010266 blood-pressure and heart-rate monitor from the released schematic and BOM. It preserves reference designators U1-U7, R1-R23, C1-C18, J1-J10, TP1-TP7, and S1, including the DNP shutdown resistor and both selectable instrumentation-amplifier paths. The example composes these reusable modules:

PowerManagement_TPS7A2433_TIDA010266
VoltageReference_ATL431LI_TIDA010266
InstrumentationAmplifier_INA350
AnalogSignalConditioning_LMV324A_TIDA010266
Microcontroller_MSPM0L1306_TIDA010266
MotorDriver_DRV8210_TIDA010266

Only blocks centered on imported TI chips are published as reusable library subcircuits. The ADC filters, connectors, jumpers, test points, programming header, internal-MCU amplifier network, and Omron pressure-sensor stage remain example-local sections used to compose the complete monitor.

The newly modeled bare parts are available under the readable names TPS7A24, ATL431LI, LMV324A, and SMPP2_03. Exact-package exports for the TI devices remain available as TPS7A2433DBVR, ATL431LIBIDBZR, and LMV324AIPWR; SMPP2_03 directly models Omron's 2SMPP03 package. The example is schematic-first (routingDisabled): place and route the PCB only after selecting the mechanical outline and validating medical-device safety requirements for the intended product.

The SeatPositionModule.circuit.tsx example stays intentionally small: it composes and electrically connects the reusable reference subcircuits for the power supply, communication interface, light driver, MCU, position feedback, and motor driver blocks.

The ConsumerWirelessModule.circuit.tsx example assembles the seven reviewed references behind TI's Consumer wireless module diagram. Its protected 5 V input feeds a 3.3 V buck rail, which powers the LVDS interface, logic buffer, and temperature sensor; the logic signal then flows through the LVDS driver and two-channel I/O protection. The antenna feed, I2C bus, and protected differential pair remain explicit parent-level ports.

System Block Builder

The standalone system-block-ui app provides a React Flow canvas for dragging these subcircuits into a system diagram. Connections stay at a readable system level—such as Power or Data—while a curated semantic catalog resolves compatible voltage rails and protocols into exact tscircuit selectors. The app generates example-style TSX and can evaluate it with PCB and routing work disabled to produce a schematic preview and downloadable PDF.

The default editor graph uses the six implementation-ready blocks from the Consumer wireless module. The antenna is temporarily omitted because it is not working properly in the editor. Its high-level Power, GPIO, and LVDS edges generate the same reviewed internal selectors as the complete example.

Open the deployed TI System Block Builder.

Raw Chip Usage

When you need the bare chip package instead of a full reference design, import the chip by its short TI part name. If that chip currently maps to a specific package footprint in lib/chips, the package keeps the underlying MPN-named definition available and exposes the short-name wrapper from the package entrypoint.

import { BQ24074 } from "@tsci/tscircuit.ti"

export default () => (
  <board width="14mm" height="14mm">
    <BQ24074 name="U1" footprintVariant="vqfn_16_ep_3x3" pcbX={0} pcbY={0} />
  </board>
)

footprintVariant is optional today and defaults to the currently available chip footprint for that short-name export. New code should use readable package names such as vqfn_16_ep_3x3 or sot_23_5.

Connecting to Pins Inside a Subcircuit

Imported TI parts are subcircuits. To connect an external component to a pin inside one of those subcircuits, use a selector string that starts with the placed subcircuit name, then selects the internal component and pin.

import { PowerMonitor_INA237 } from "@tsci/tscircuit.ti"

export default () => (
  <board width="22mm" height="16mm">
    <PowerMonitor_INA237 name="INA237" />
    <resistor
      name="R11"
      resistance="1k"
      footprint="0402"
      pcbX={7}
      pcbY={-3}
      connections={{
        pin1: ".INA237 .J1 .SCL",
      }}
    />
  </board>
)

The selector ".INA237 .J1 .SCL" means:

.INA237 selects the placed INA237 subcircuit.
.J1 selects the internal connector named J1 inside that subcircuit.
.SCL selects the SCL pin on that connector.

Use the same pattern for other exported TI subcircuits and their internal components. For example, ".INA237 .U1 .VS" selects the VS pin on the internal U1 chip inside the placed INA237 subcircuit.

Exported Subcircuits

INA350 instrumentation amplifier

InstrumentationAmplifier_INA350 contains only INA350CDSIDSGR and a 100 nF bypass capacitor: the U5/C13 amplifier stage in TI TIDA-010266, Figure 4-1. It contains no pin headers, connectors, or gain-selection jumper. The usage example below also uses only named parent nets, with no header. J10 in TI's schematic is an optional parent-board gain jumper, not part of this module.

The CDS variant provides gains 30/50 V/V. gain="external" (default) exposes GS for the parent: low selects 30, high or unconnected selects 50. gain={30} or gain={50} straps GS internally to GND or VS. REF is not grounded; drive it from a low-impedance source such as the buffered 1.25 V reference in TIDA-010266. shutdown="external" (default) exposes SHDN; high or unconnected enables the amplifier, while low disables it. shutdown="enabled" ties SHDN to VS. Do not populate a pull-down on SHDN if the amplifier must remain enabled.

import { InstrumentationAmplifier_INA350 } from "@tsci/tscircuit.ti"

export default () => (
  <board width="12mm" height="10mm" routingDisabled>
    <InstrumentationAmplifier_INA350 name="Amp" gain="external" />
    <trace from=".Amp .U1 > .VS" to="net.V3_3" />
    <trace from=".Amp .U1 > .V_NEG" to="net.GND" />
    <trace from=".Amp .U1 > .IN_POS" to="net.INA_IN_POS" />
    <trace from=".Amp .U1 > .IN_NEG" to="net.INA_IN_NEG" />
    <trace from=".Amp .U1 > .OUT" to="net.INA_OUT" />
    <trace from=".Amp .U1 > .REF" to="net.VREF_1_25" />
    <trace from=".Amp .U1 > .GS" to="net.INA_GS" />
  </board>
)

The supply, reference generator, sensor, ADC/filter, and optional controls belong to the parent circuit. Named nets do not generate voltages or add physical terminals: the example disables routing until the parent supplies real endpoints. Connect an optional MCU shutdown signal to .Amp .U1 > .SHDN. REF, GS, and SHDN remain separate from ground unless explicitly wired otherwise by the parent or selected props. V- and the exposed pad are grounded, and C1 bypasses VS to GND.

Supply VS with 1.8-5.5 V. Inputs need a DC bias-current return path and must meet the INA350 datasheet's common-mode/output-swing limits. The module uses 0.1 mm traces. Fixed gain 50 uses a bottom-layer strap and two vias to keep the SHDN escape clear; use at least two copper layers. Verify the completed parent board's routing and fabrication clearances. It has no analog simulation model and is not a validated medical-device design.

INA350 defaults to the raw INA350CDSIDSGR chip with footprintVariant="wson_8_ep_2x2". The exact INA350ABSIDSGR export is also available for designs requiring gains 10/20. Both share the DSG0008A footprint and pinout, but their gain settings are not interchangeable. No supplier SKU or 3D model is assumed.

DRV8210 PWM motor driver

MotorDriver_DRV8210 implements the full-bridge PWM application for the 8-pin WSON DRV8210DSGR. The Controller and BDC motor use group showAsSchematicBox with real schematic signal ports, not PCB components. Their port-to-port traces use schDisplayLabel for inline PWM1/PWM2 and OUT1/OUT2 labels. Local bypass-capacitor ground labels keep ground wiring clear of those signals. The two PWM inputs drive IN1 and IN2; OUT1 and OUT2 connect to the motor.

import { MotorDriver_DRV8210 } from "@tsci/tscircuit.ti"

export default () => (
  <board width="16mm" height="12mm">
    <MotorDriver_DRV8210 name="Driver" />
  </board>
)

Connect a parent circuit to .Driver .U1 > .IN1, .Driver .U1 > .IN2, .Driver .U1 > .OUT1, .Driver .U1 > .OUT2, .Driver .U1 > .VM, .Driver .U1 > .VCC, and .Driver .U1 > .GND. The schematic labels are PWM1, PWM2, OUT1, OUT2, VM, VCC, and GND respectively.

Unlike the six-pin DRL reference diagram, the DSG device also requires a separate VCC supply and MODE selection. This subcircuit grounds MODE for PWM, grounds the exposed thermal pad, and includes 0.1 uF bypass capacitors on both VM and VCC. Keep VCC within 1.65–5.5 V and VM within the DSG operating range of 0–11 V; add VM bulk capacitance sized for your motor and supply. See the TI pinout and supply requirements, PWM mode, and bulk capacitance guidance.

The raw chip is available as DRV8210DSGR or as DRV8210 with footprintVariant="wson_8_ep_2x2".

LP5892-Q1 LED matrix output interface

OutputUserInterface_LEDMatrix_LP5892_Q1 implements the 48-source, 16-scan-line interface for a common-cathode 16-by-16 RGB LED matrix. It exposes the four supply domains (VCC, VR, VG, and VB), GND, the SCLK/SIN/SOUT serial interface, R0-R15, G0-G15, B0-B15, and LINE0-LINE15 as public subcircuit nets. Connect from a parent circuit with selectors such as .DisplayDriver > net.SCLK, .DisplayDriver > net.R0, and .DisplayDriver > net.GND.

import { OutputUserInterface_LEDMatrix_LP5892_Q1 } from "@tsci/tscircuit.ti"

export default () => (
  <board width="28mm" height="24mm" isViaInPadAllowed>
    <OutputUserInterface_LEDMatrix_LP5892_Q1 name="DisplayDriver" />
    <led
      name="D_R0_LINE0"
      color="red"
      footprint="0603"
      connections={{
        anode: ".DisplayDriver > net.R0",
        cathode: ".DisplayDriver > net.LINE0",
      }}
    />
  </board>
)

The internal 23 kohm IREF resistor matches TI's 3 mA, BC=011 design example; firmware must configure the matching brightness/current registers. SCLK must run continuously and SIN should remain high while idle. VCC and VR may share a rail, as may VG and VB; use at least 3.5 V on VCC when operating at 20 mA or more per channel.

The exposed-pad thermal-via array requires isViaInPadAllowed on the parent board. Follow TI's fabrication guidance by filling, plugging, or tenting the vias. The implementation follows the LP5892-Q1 datasheet and the related LP5891Q1EVM hardware guide.

Available subcircuits

The package currently exports these subcircuit components:

BatteryManagement_BQ24072
BatteryManagement_BQ24073
BatteryManagement_BQ24074
BatteryManagement_BQ25895
BatteryManagement_BQ27441G1
RealTimeClock_BQ32002
WirelessMCU_CC2340R5
BluetoothController_CC2564C
WirelessMCU_CC2745R10
WirelessMCU_CC3235SF
MotorDriver_DRV8210
MotorDriver_DRV8833
MotorDriver_DRV8876
PositionFeedback_DRV5013
MotorDriver_DRV8305_TIDA01330 (TIDA-01330)
EnvironmentalSensor_HDC2080
EnvironmentalSensor_HDC3020
EnvironmentalSensor_HDC3022
PowerMonitor_INA237
InstrumentationAmplifier_INA350
PressureTransmitter_PGA300
IsolatedRS485_ISOW7841
ClockBuffer_LMK1C1104
AudioAmplifier_TAS2505
TargetSocket_MSPTS430D8
BluetoothAudioHost_MSP430F5229
Microcontroller_MSPM0G3507
Microcontroller_MSPM0L1306Q1_TIDA020065 (TIDA-020065)
Microcontroller_MSPM33C3x
LEDDriver_TLC59116
OutputUserInterface_LEDMatrix_LP5892_Q1
TemperatureSensor_TMP1075
TemperatureSensor_TMP1827
MotorThermalProtection_TMP390 (datasheet-derived; not an exact Window Module reference design)
TemperatureSensor_LM50HV_Q1 (LM50-Q1/LM50HV-Q1 datasheet, Figure 8-3; used because the Rearview Mirror Module block has no attached reference design)
PowerSupply_LM74202_TPS7E81_Q1 (LM74202-Q1 datasheet, page-1 Simplified Schematic and Figure 39 values and TPS7E81-Q1 datasheet, Figure 7-5; used because the Rearview Mirror Module block has no attached reference design)
LoadSwitch_TPS22919
BuckConverter_TPS62933
BoostConverter_TPS61299X (also exported as TPS61299XBoostConverter)
PowerManagement_TPS6521835
BuckBoostConverter_TPS63802
PowerManagement_TPS7A02
PowerManagement_TPS7A20
PowerManagement_TPS7A2018
PowerManagement_TPS7A2028
PowerManagement_TLV755P
PowerModule_TPSM82823
LevelShifter_TXB0104
LevelShifter_TXS0102
RFIDReader_TRF7960
CommunicationInterface_LIN_TLIN1028
CommunicationInterface_TCAN1042_TIDA01428 (TIDA-01428)
LightDriver_TIDA01330 (TIDA-01330)
PositionFeedback_DRV5013_TIDA01389 (TIDA-01389)
PowerSupply_LM5050_TIDA00992 (TIDA-00992)
ElectrochromicMirrorDriver_TIDA01539 (TIDA-01539)
LightSensor_OPT3001_TIDA01539 (TIDA-01539)
LogicBuffer_SN74LVC1G34 (SN74LVC1G34 typical application)
WirelessAntenna_W3006_TIDCWL1837MODCOM8I (TIDC-WL1837MODCOM8I)
InputOutputProtection_TPD2E009_TIDA00399 (TIDA-00399)
BuckConverter_TPS62086_TIDA00399 (TIDA-00399)
InputPowerProtection_TPS25910_TIDA00890 (TIDA-00890)
TemperatureSensor_TMP103_TIDA00399 (TIDA-00399)
LVDSDriver_SN65LVDS31_TIDA060017 (TIDA-060017)
LampDriver_TPS92638_TIDA00356 (TIDA-00356)

Exported Chips

The package also exports these low-level chip components from lib/chips. Each chip is listed individually below, including whether it supports a footprintVariant selector on the short-name export.

Chip Export	`footprintVariant`	Underlying Component Export
`AM62L32`	`fccsp_373_anb`	`AM62L32BOGHAANBR`
`BQ24074`	`vqfn_16_ep_3x3`	`BQ24074RGTR`
`BQ25895`	`wqfn_24_ep_4x4`	`BQ25895RTWR`
`BQ27441G1`	`vson_12_ep_2p5x4`	`BQ27441DRZR_G1B`
`CC2340R5`	`-`	`CC2340R5`
`CC2564C`	`-`	`CC2564C`
`CC2745R10`	`-`	`CC2745R10E0WRHARQ1`
`CC3235SF`	`vqfn_64_ep`	`CC3235SF12RGKR`
`CSD19532Q5B`	`-`	`CSD19532Q5B`
`DAC101C081Q`	`-`	`DAC101C081QISD_NOPB`
`DRV5013Q1`	`-`	`DRV5013ADQDBZRQ1`
`DRV8210`	`wson_8_ep_2x2`	`DRV8210DSGR`
`DRV8833`	`-`	`DRV8833`
`DRV8876`	`-`	`DRV8876`
`DRV83053Q1`	`-`	`DRV83053QPHPQ1`
`HDC2080`	`wson_6_ep_3x3`	`HDC2080DMBR`
`HDC3020`	`wson_8_ep_2p5x2p5`	`HDC3020DEFR`
`HDC3022`	`wson_8_ep_2p5x2p5`	`HDC3022DEJR`
`INA237`	`vssop_10`	`INA237AQDGSRQ1`
`INA350`	`wson_8_ep_2x2`	`INA350CDSIDSGR`
`ISOW7841`	`soic_16_wide`	`ISOW7841DWR`
`LM74202Q1`	`-`	`LM74202QPWPRQ1`
`LM50HVQ1`	`-`	`LM50HVQDBZRQ1`
`LMK1C1104`	`tssop_8`	`LMK1C1104PWR`
`LM5050Q1`	`-`	`LM5050Q1MKX_1_NOPB`
`LP5892Q1`	`vqfn_76_ep_9x9`	`LP5892QRRFRQ1`
`MSP430G2230ID`	`-`	`MSP430G2230ID`
`MSP430F5229`	`-`	`MSP430F5229IRGCR`
`MSPM0L1306Q1`	`-`	`MSPM0L1306QRHBRQ1`
`MSPM0G3507`	`lqfp_64`	`MSPM0G3507SPMR`
`OPT3001`	`-`	`OPT3001IDNPRQ1`
`PGA300ARHHR`	`-`	`PGA300ARHHR`
`SN65HVD1473`	`vssop_10`	`SN65HVD1473DGSR`
`SN65LVDS31D`	`-`	`SN65LVDS31D`
`SN74LVC1G34DBVR`	`-`	`SN74LVC1G34DBVR`
`TCAN1042HGV`	`-`	`TCAN1042HGVDRBQ1`
`TLIN1028`	`soic_8_powerpad`	`TLIN10283DDARQ1`
`TLV755P`	`sot_23_5`	`TLV75533PDBVR`
`TLV316`	`-`	`TLV316QDBVTQ1`
`TAS2505`	`-`	`TAS2505`
`TMP103AYFF`	`-`	`TMP103AYFF`
`TMP1827`	`-`	`TMP1827`
`TMP1075`	`wson_8_ep_2x2`	`TMP1075DSGR`
`TMP390Q1`	`-`	`TMP390AQDRLRQ1`
`TPD2E009DRTR`	`-`	`TPD2E009DRTR`
`TPS22919`	`-`	`TPS22919`
`TPS25910RSA`	`-`	`TPS25910RSA`
`TPS62086RLTR`	`-`	`TPS62086RLTR`
`TPS6293`	`-`	`TPS6293`
`TPS61299X`	`sot_563_6`	`TPS61299DRLR`
`TPS63802`	`vson_hr_10`	`TPS63802DLAR`
`TPS7A02`	`sot_23_5`	`TPS7A0230PDBVR`
`TPS7A20`	`sot_23_5`	`TPS7A2018PDBVR`, `TPS7A2033PDBVR`
`TPS7E81Q1`	`-`	`TPS7E8133QDBVRQ1`
`TPS92638`	`-`	`TPS92638QPWPRQ1`
`TPS7A2028PDBVR`	`-`	`TPS7A2028PDBVR`
`TPSM82823`	`-`	`TPSM82823`
`TXB0104`	`vqfn_14_ep_3p5x3p5`	`TXB0104RGYR`
`TXS0102`	`vssop_8`	`TXS0102DCUR`
`W3006`	`-`	`W3006`

Rows with - are direct chip exports and do not currently expose a footprintVariant prop. For the wrapper exports, the underlying component exports are also re-exported from the package when you want to import the exact low-level definition directly.

The package also exports:

TiChipComponents: an object map of all exported short-name chip components.
TiChipName: a TypeScript union of keys in TiChipComponents.
TiChipComponent: a TypeScript type for any exported chip component.
TiSubcircuitComponents: an object map of all exported subcircuit components.
TiSubcircuitName: a TypeScript union of keys in TiSubcircuitComponents.
TiSubcircuitComponent: a TypeScript type for any exported subcircuit component.

TMP390-Q1 Motor Thermal Protection Source Scope

MotorThermalProtection_TMP390 is derived from TMP390-Q1 datasheet Figure 7-1 for topology and relative schematic placement, and Figure 8-3 plus Tables 7-1 and 7-2 for component values and thresholds. It is not an exact TI Window Module reference design because TI does not attach schematic or CAD source to that subsystem.

The fixed datasheet example exposes VDD, VDDIO, GND, OUTA, and OUTB. It selects a +90 C hot trip and -25 C cold trip with 10 C hysteresis. The active-low, open-drain outputs reset at +80 C and -15 C, respectively.

Key Directories

`lib/chips`

The lib/chips directory contains the low-level TI chip components. Most files represent an individual manufacturer part number and define details such as pin labels, aliases, supplier part numbers, and the physical footprint used by tscircuit.

Import chips from the package entrypoint by their short names, such as BQ24074, INA237, or TPS7A02. The underlying MPN-named definitions remain available as direct exports when you need to pin a specific source component. Most users should still start with the higher-level subcircuits, but the chip definitions are the building blocks those subcircuits use internally.

`lib/subcircuits`

The lib/subcircuits directory contains reusable reference circuits built around the chip definitions. A subcircuit usually includes the main TI part plus supporting components such as capacitors, resistors, connectors, net labels, and traces.

These are the components exported from the package entrypoint in index.ts. For example, PowerMonitor_INA237 comes from lib/subcircuits/PowerMonitor_INA237.circuit.tsx and can be imported from @tsci/tscircuit.ti.

PositionFeedback_DRV5013 extracts the Window Module "Position Feedback - Hall Effect Sensors" function from TI's TIDA-01389. The Window Module subsystem's own Reference Design tab currently lists no design, so TIDA-01389 was selected from the closely related Motor Driver references: TI explicitly identifies it for sunroof and window-lift applications and implements motor position encoding with two DRV5013-Q1 latching Hall sensors. This extraction is independent of the DRV8703/H-bridge work in PR #116 and does not duplicate that motor-driver circuitry.

The TIDA-01389 BOM identifies U5/U6 as DRV5013ADQDBZRQ1, C13/C14 as GRM155R61H104ME14D, R14/R15 as CRCW040210K0JNED, R9 as CRCW06030000Z0EA, J1/J2 as SSQ-110-01-T-S, and J4 as Wurth Elektronik 691214310002. Following repository convention, passive and connector MPNs are documented here instead of being rendered as schematic component values. Hall-channel and connector GND pins use ordinary traces to net.GND so tscircuit generates native ground symbols; V_BAT alone uses schDisplayLabel as an inline trace label. No passive or net-label component has a custom schematic size.

The lib/subcircuits/__snapshots__ directory contains generated schematic and PCB SVG snapshots used to check visual output.

`lib/thirdparty-subcircuits`

The lib/thirdparty-subcircuits directory contains application wiring circuits for blocks that do not provide a TI reference design. These circuits clearly identify the datasheet figure used as their source. For example, TemperatureSensor_LM50HV_Q1 follows Figure 8-3 of the LM50-Q1/LM50HV-Q1 datasheet, while PowerSupply_LM74202_TPS7E81_Q1 combines the LM74202-Q1 page-1 Simplified Schematic (with Figure 39 values) and the TPS7E81-Q1 Figure 7-5 fixed-output LDO stage.

`lib/simulations`

The lib/simulations directory contains example circuits for simulation-focused TI use cases. These files exercise selected parts and reference designs, such as driver PWM behavior or switching regulator waveforms.

Simulation examples may use model data from lib/chips/spice-models. The lib/simulations/__snapshots__ directory stores generated schematic and simulation SVG snapshots.

Development

Install dependencies:

bun install

Run the tscircuit dev server:

bun run dev

Build the package:

bun run build

Run TypeScript checks:

bun run typecheck

Update visual snapshots when intentional schematic, PCB, or simulation output changes:

bun run snapshot:update

Name		Name	Last commit message	Last commit date
.github		.github
docs		docs
examples		examples
imports		imports
lib		lib
scripts		scripts
system-block-ui		system-block-ui
tests		tests
.gitignore		.gitignore
.npmrc		.npmrc
README.md		README.md
biome.json		biome.json
bunfig.toml		bunfig.toml
index.ts		index.ts
package.json		package.json
tscircuit.config.json		tscircuit.config.json
tscircuit.config.ts		tscircuit.config.ts
tsconfig.json		tsconfig.json
vercel.json		vercel.json

Navigation Menu

Uh oh!

Repository files navigation

TI tscircuit library

Installation

Basic Usage

Complete Examples

System Block Builder

Raw Chip Usage

Connecting to Pins Inside a Subcircuit

Exported Subcircuits

INA350 instrumentation amplifier

DRV8210 PWM motor driver

LP5892-Q1 LED matrix output interface

Available subcircuits

Exported Chips

TMP390-Q1 Motor Thermal Protection Source Scope

Key Directories

`lib/chips`

`lib/subcircuits`

`lib/thirdparty-subcircuits`

`lib/simulations`

Development

About

Releases

Packages

Contributors

Languages

Uh oh!

Latest commit

History

Folders and files

Repository files navigation

TI tscircuit library

Installation

Basic Usage

Complete Examples

System Block Builder

Raw Chip Usage

Connecting to Pins Inside a Subcircuit

Exported Subcircuits

INA350 instrumentation amplifier

DRV8210 PWM motor driver

LP5892-Q1 LED matrix output interface

Available subcircuits

Exported Chips

TMP390-Q1 Motor Thermal Protection Source Scope

Key Directories

lib/chips

lib/subcircuits

lib/thirdparty-subcircuits

lib/simulations

Development

About

Resources

Stars

Watchers

Forks

Releases

Packages

Contributors

Languages

`lib/chips`

`lib/subcircuits`

`lib/thirdparty-subcircuits`

`lib/simulations`